Features
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
Fast response time: typically less than 1.0ps from 0 Volts to V(BR)
Typical IR less than 1µA above 10V
High Temperature solderting: 260°C/10 seconds at terminals
Plastic package has Underwriters Laboratory Flammability 94V-O
Pb-free plated
Mechanical Data
Case: JEDEC DO-214AC. Molded plastic over glass passivated junction
Terminals: Solderable per MIL-STD-750,Method 2026
Polarity: Color band denoted positive end (cathode) except Bidirectional
Data Sheet
